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The following is an unedited press release, shown as received from the company represented. We've elected to present selected releases without editorial comment, as a way to provide our readers more information without further overtaxing our limited editorial resources. To avoid any possible confusion or conflict of interest, the Imaging Resource will always clearly distinguish between company-provided press releases and our own editorial views and content.

PRESS RELEASE: Next Generation DALSA Chips Power New Digital Camera Backs


WATERLOO, ONTARIO--(CCNMatthews - Nov. 17, 2005) - DALSA Corporation (TSX:DSA), an international high performance semiconductor and electronics company, today announced that its next generation 33 mega-pixel and 28 mega-pixel CCD image sensors chips have been designed into new digital camera backs.

The new Leaf Aptus 75 medium and large format digital camera back, which was recently launched at the PhotoPlus Expo, is powered by DALSA's new 33 mega-pixel FTF5066 CCD image sensor. The camera back, which will begin shipping in November, produces stunning 16 bit images with file sizes of nearly 200 megabytes. The Leaf Aptus 65, which will be available early in 2006, features the 28 mega-pixel FTF6146 DALSA chip and generates high quality 160 megabyte image files, also at 16 bit.

Beyond pure resolving power, DALSA's new image sensor chips are the most feature-rich in the industry, with large 7.2 micron pixels for the widest possible dynamic range, industry leading frame rates, instant response (no shutter lag) and low power consumption.

"We're pleased to once again supply Leaf, a valued customer, with our latest professional-grade image sensor products," said Brian Doody, President of DALSA Digital Imaging. "These sensors set a new benchmark not only for image quality, but also for unique features that directly benefit professional photographers."

About DALSA Corporation
DALSA is an international high performance semiconductor and electronics company that designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. DALSA's core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing. Products and services include image sensor components; electronic digital cameras; vision processors; image processing software; and semiconductor wafer foundry services for use in MEMS, high-voltage semiconductors, image sensors and mixed-signal CMOS chips. DALSA is listed on the Toronto Stock Exchange under the symbol "DSA". The Company has its corporate offices in Waterloo, ON and approximately 1000 employees world-wide.

This press release contains forward looking statements based on assumptions, uncertainties and management's best estimates of future events. Actual results may differ materially from those currently anticipated. Investors are cautioned that such forward-looking statements involve risks and uncertainties. Important factors that could cause actual results to differ materially from those expressed or implied by such forward looking statements are detailed from time to time in DALSA's periodic reports filed with the Ontario Securities Commission and other regulatory authorities. DALSA has no intention or obligation to update or revise any forward-looking statements, whether as a result of new information, future events or otherwise.


(First posted on Thursday, November 17, 2005 at 10:08 EST)

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